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Semiconductor device fabrication
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#	Item
421	ARTICLE Received 7 Jun 2014 \| Accepted 11 Feb 2015 \| Published 18 Mar 2015 DOI: ncomms7620 Single-step deposition of high-mobility graphene Add to Reading List Source URL: kni.caltech.edu Language: English - Date: 2015-03-18 17:06:44 Superhard materials Semiconductor device fabrication Thin film deposition Nanomaterials Emerging technologies Graphene Chemical vapor deposition Silicon carbide Epitaxy Chemistry Manufacturing Matter
422	IESA signs MoU with Singapore Semiconductor Industry Association (SSIA)to fortify India-Singapore ESDM industry collaborations White paper with emphasis onIndia-Singapore ESDM trade, investment and industry collaboration Add to Reading List Source URL: iesaonline.org Language: English - Date: 2015-02-11 00:40:39 Republics Singapore Semiconductor Equipment and Materials International Semiconductor industry Semiconductor fabrication plant International relations Semiconductor device fabrication Political geography Technology
423	APPLIED PHYSICS LETTERS VOLUME 81, NUMBER 1 1 JULY 2002 Add to Reading List Source URL: www.princeton.edu Language: English - Date: 2009-09-30 16:05:46 Semiconductor device fabrication Thin film deposition Nanotechnology Analytical chemistry Nanofluidic circuitry Nanoimprint lithography Focused ion beam Sputtering Photolithography Chemistry Materials science Physics
424	WEHEN WL-2402 Wirebonder (vPurpose The Model WL-2402 bonder is an ultrasonic wedge wire bonder designed to Add to Reading List Source URL: www.chemistry.hku.hk Language: English - Date: 2015-05-06 04:34:48 Transport Chemical bond Bond Railroad switch Ball bonding Semiconductor device fabrication Wire bonding Technology
425	Séminaire SOLEIL Contribution of Molecular Beam Epitaxy and Synchrotron facilities on Spintronics Stéphane ANDRIEU Add to Reading List Source URL: www.synchrotron-soleil.fr Language: English - Date: 2015-02-18 06:59:24 Materials science Condensed matter physics Emerging technologies Semiconductor device fabrication SOLEIL Tunnel magnetoresistance Molecular beam epitaxy Epitaxy Nanomagnet Spintronics Thin film deposition Physics
426	Embedding of Chips for System in Package realization – Technology and Applications Lars Boettcher 1, Dionysios Manessis 2, Andreas Ostmann 1 Stefan Karaszkiewicz 2 and Herbert Reichl 2 1 Fraunhofer Institute for Relia Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-06 04:02:53 Integrated circuits Semiconductor devices Electronics manufacturing Electrical engineering Semiconductor device fabrication Quad-flat no-leads package Printed circuit board Three-dimensional integrated circuit Flip chip Electronics Electromagnetism Electronic engineering
427	Cleanroom safety authorization checklist Before being authorized to use the clean room you must be able to check off all of the following points and make yourself familiar with the appendices and links mentioned (all doc Add to Reading List Source URL: wiki.nbi.ku.dk Language: English - Date: 2013-06-20 08:39:03 Filters Rooms NBI Nanowire Hydrofluoric acid Chemistry Semiconductor device fabrication Cleanroom
428	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2013-01-18 04:24:22 Technology Electronics manufacturing Chemical bonding Wafer bonding Microelectromechanical systems Deep reactive-ion etching Wafer Through-silicon via EV Group Semiconductor device fabrication Materials science Microtechnology
429	Good cleanroom practice and rules at NBI The safety of you and coworkers in the lab is of utmost importance. Although we encourage constructive feedback on safety procedures, and how to improve them, you must accept that Add to Reading List Source URL: wiki.nbi.ku.dk Language: English - Date: 2015-03-02 03:29:55 Health Risk Filters Rooms Semiconductor device fabrication Cleanroom Fume hood Occupational safety and health Material safety data sheet Safety Industrial hygiene Safety engineering
430	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-05-05 17:47:15 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology

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